Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817407 | Molded semiconductor package with high voltage isolation | Shao Ping Wan, Eric Brion Acquitan, Dexter Reynoso, Woon Yik Yong | 2023-11-14 |
JS
Jürgen Schredl
Overall (2023): #377,676 of 537,848Top 75%
1
Patents 2023