Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817407 | Molded semiconductor package with high voltage isolation | Shao Ping Wan, Eric Brion Acquitan, Jürgen Schredl, Woon Yik Yong | 2023-11-14 |
| 11699647 | Pre-molded lead frames for semiconductor packages | Balehithlu Manjappaiah Upendra, Romel Solanoy LAZALA, Mohamad Yazid Bin WAGIMAN | 2023-07-11 |