Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769748 | Semiconductor device having a metal clip with a solder volume balancing reservoir | Michael Stadler, Mohd Hasrul Zulkifli | 2023-09-26 |
| 11699640 | Power semiconductor module for PCB embedding, power electronic assembly having a power module embedded in a PCB, and corresponding methods of production | Frank Daeche, Chee Voon Tan | 2023-07-11 |
| 11621204 | Molded semiconductor module having a mold step for increasing creepage distance | Oliver Markus Kreiter, Ludwig Busch, Angel Enverga, Mei Fen Hiew, Tian See Hoe +7 more | 2023-04-04 |
| 11545459 | Metal clip with solder volume balancing reservoir | Michael Stadler, Mohd Hasrul Zulkifli | 2023-01-03 |