Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11738411 | Lead-free solder paste with mixed solder powders for high temperature applications | Hongwen Zhang, Huaguang Wang, Jie Geng, Francis M. Mutuku, Ning-Cheng Lee | 2023-08-29 |