Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11752579 | High reliability leadfree solder alloys for harsh service conditions | Jie Geng, Ning-Cheng Lee | 2023-09-12 |
| 11738411 | Lead-free solder paste with mixed solder powders for high temperature applications | Samuel Lytwynec, Huaguang Wang, Jie Geng, Francis M. Mutuku, Ning-Cheng Lee | 2023-08-29 |
| 11712762 | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders | Fen Chen, Francis M. Mutuku, Jie Geng, Ning-Cheng Lee | 2023-08-01 |