Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11738411 | Lead-free solder paste with mixed solder powders for high temperature applications | Hongwen Zhang, Samuel Lytwynec, Huaguang Wang, Jie Geng, Ning-Cheng Lee | 2023-08-29 |
| 11712762 | Low temperature melting and mid temperature melting lead-free solder paste with mixed solder alloy powders | Hongwen Zhang, Fen Chen, Jie Geng, Ning-Cheng Lee | 2023-08-01 |