Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810892 | Method of direct bonding semiconductor components | Jaber Derakhshandeh, Gerald Beyer | 2023-11-07 |
| 11769750 | Substrate, assembly and method for wafer-to-wafer hybrid bonding | Joeri De Vos | 2023-09-26 |