Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769750 | Substrate, assembly and method for wafer-to-wafer hybrid bonding | Eric Beyne | 2023-09-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769750 | Substrate, assembly and method for wafer-to-wafer hybrid bonding | Eric Beyne | 2023-09-26 |