Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810892 | Method of direct bonding semiconductor components | Eric Beyne, Gerald Beyer | 2023-11-07 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11810892 | Method of direct bonding semiconductor components | Eric Beyne, Gerald Beyer | 2023-11-07 |