Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11794177 | Surface-modified light upconversion silica particles | Jason T. Wertz, Brandon M. Kobilka, Sarah K. Czaplewski-Campbell | 2023-10-24 |
| 11779916 | Moisture and volatile organic compound content measuring | Sarah K. Czaplewski-Campbell, Brandon M. Kobilka, Scott B. King | 2023-10-10 |
| 11738514 | Method and system to reduce waste during 3D printing | Tyler Smith, Joseph Goergen, Minoru Fernando, Timothy J. Lindquist, Justin Somers | 2023-08-29 |
| 11729472 | Content access based on location token | Chad Albertson, Christopher W. Steffen, Nicholas Ollerich | 2023-08-15 |
| 11703922 | Thermal interface material structures for directing heat in a three-dimensional space | Mark K. Hoffmeyer, Christopher M. Marroquin, Sarah K. Czaplewski-Campbell, Phillip V. Mann | 2023-07-18 |
| 11617519 | Needle electrode for position-dependent injection | Sarah K. Czaplewski-Campbell, Jennifer I. Bennett, Elin F. LaBreck, Christopher W. Steffen | 2023-04-04 |
| 11572503 | Light upconversion microcapsule shells | Brandon M. Kobilka, Jason T. Wertz, Sarah K. Czaplewski-Campbell | 2023-02-07 |
| 11570156 | Secure pairing of devices | Christopher W. Steffen, Chad Albertson, Nicholas Ollerich | 2023-01-31 |
| 11558964 | Process for in-situ warpage monitoring during solder reflow for head-in-pillow defect escape prevention | Jennifer I. Bennett, Steven Chandler Borrillo, Sarah K. Czaplewski-Campbell | 2023-01-17 |