Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11805603 | Applying a solderable surface to conductive ink | Prabjit Singh | 2023-10-31 |
| 11784424 | Reliability enhancement of press fit connectors | Theron Lee Lewis | 2023-10-10 |
| 11774190 | Pierced thermal interface constructions | — | 2023-10-03 |
| 11751369 | Liquid metal infiltration rework of electronic assembly | Timothy P. Younger | 2023-09-05 |
| 11703922 | Thermal interface material structures for directing heat in a three-dimensional space | Christopher M. Marroquin, Eric J. Campbell, Sarah K. Czaplewski-Campbell, Phillip V. Mann | 2023-07-18 |
| 11664302 | Integrated circuit module with a structurally balanced package using a bottom side interposer | — | 2023-05-30 |