Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11558964 | Process for in-situ warpage monitoring during solder reflow for head-in-pillow defect escape prevention | Jennifer I. Bennett, Sarah K. Czaplewski-Campbell, Eric J. Campbell | 2023-01-17 |