Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11805592 | Circuit board assembly and electronic device | Fei Ma, Wei Fang, Zhiwen Yang, Chungang Li, Shun Hao | 2023-10-31 |
| 11776820 | Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method | Xiaoyun WEI, Yong Yang | 2023-10-03 |