Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11849559 | Interconnection structure used in electronic device and method for assembling interconnection structure | Xuguang Yang, Shaohua Zhang, Zelong JIAO | 2023-12-19 |
| 11805592 | Circuit board assembly and electronic device | Chaojun Deng, Fei Ma, Wei Fang, Chungang Li, Shun Hao | 2023-10-31 |