Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11776820 | Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method | Yong Yang, Chaojun Deng | 2023-10-03 |
XW
Xiaoyun WEI
Overall (2023): #203,149 of 537,848Top 40%
1
Patents 2023