Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11742295 | Interface of integrated circuit die and method for arranging interface thereof | Ting Wang, Ting-Chin Cho, Igor Elkanovich, Amnon Parnass, Chia-Hsiang Chang +13 more | 2023-08-29 |
| 11695596 | Multi-level signal transmitter and method thereof | Chia-Liang Lin | 2023-07-04 |
| 11601099 | Multi-stage wide-band amplifier with intra-stage and inter-stage inductive coupling | Chia-Liang Lin | 2023-03-07 |