Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705419 | Packaging structure for bipolar transistor with constricted bumps | Ryoichi Kato, Tatsuo Nishizawa, Eiji Mochizuki | 2023-07-18 |
| 11664342 | Semiconductor device with a laser-connected terminal | Shinji Tada, Ryoichi Kato, Yuma MURATA | 2023-05-30 |
| 11658231 | Semiconductor device | Motohito HORI, Akira Hirao, Tsunehiro Nakajima | 2023-05-23 |
| 11545409 | Semiconductor module having block electrode bonded to collector electrode and manufacturing method thereof | Ryoichi Kato, Tatsuo Nishizawa, Motohito HORI, Eiji Mochizuki | 2023-01-03 |