Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658231 | Semiconductor device | Motohito HORI, Yoshinari Ikeda, Tsunehiro Nakajima | 2023-05-23 |
| 11623429 | Electrical debonding adhesive sheet, joined body, and joining and separation method for adherend | Kaori Akamatsu, Kaori MIZOBATA, Ryo AWANE, Junji Yokoyama, Yosuke Shimizu | 2023-04-11 |
| 11605582 | Semiconductor device | Takahiro Mitsumoto, Motohito HORI | 2023-03-14 |