Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705419 | Packaging structure for bipolar transistor with constricted bumps | Ryoichi Kato, Yoshinari Ikeda, Eiji Mochizuki | 2023-07-18 |
| 11545409 | Semiconductor module having block electrode bonded to collector electrode and manufacturing method thereof | Ryoichi Kato, Yoshinari Ikeda, Motohito HORI, Eiji Mochizuki | 2023-01-03 |