Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581252 | Semiconductor module and wire bonding method | Takafumi Yamada, Kohei Yamauchi, Hiromichi Gohara | 2023-02-14 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11581252 | Semiconductor module and wire bonding method | Takafumi Yamada, Kohei Yamauchi, Hiromichi Gohara | 2023-02-14 |