Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11624562 | Heat sink | Takumi Nakamura, Eiji Anzai, Tomoyuki Hirayama, Yutaka Hirano, Ryoichi Kato +1 more | 2023-04-11 |
| 11581252 | Semiconductor module and wire bonding method | Takafumi Yamada, Tatsuhiko Asai, Hiromichi Gohara | 2023-02-14 |
| 11556069 | Toner | — | 2023-01-17 |