Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11664296 | Semiconductor module and vehicle | Kensuke Matsuzawa, Takahiro Koyama | 2023-05-30 |
| D983759 | Semiconductor module | Daiki YOSHIDA, Shin Soyano | 2023-04-18 |
| 11624562 | Heat sink | Takumi Nakamura, Eiji Anzai, Tomoyuki Hirayama, Yutaka Hirano, Ryoichi Kato +1 more | 2023-04-11 |
| 11581252 | Semiconductor module and wire bonding method | Takafumi Yamada, Kohei Yamauchi, Tatsuhiko Asai | 2023-02-14 |
| 11582889 | Semiconductor module and vehicle | Takafumi Yamada, Daiki YOSHIDA | 2023-02-14 |