Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11833636 | Substrate polishing apparatus, method of creating thickness map, and method of polishing a substrate | Katsuhide Watanabe, Yoichi Shiokawa, Akira Nakamura | 2023-12-05 |
| 11759913 | Polishing method and polishing apparatus | Yoichi Shiokawa, Toshimitsu Sasaki, Yuki Watanabe, Nachiketa CHAUHAN | 2023-09-19 |