Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854891 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi | 2023-12-26 |
| 11764114 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi | 2023-09-19 |
| 11764115 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi | 2023-09-19 |
| 11756831 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Byeongdeck Jang, Shunsuke Teranishi | 2023-09-12 |