Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854891 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2023-12-26 |
| 11764114 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2023-09-19 |
| 11764115 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2023-09-19 |
| 11756831 | Wafer manufacturing method and laminated device chip manufacturing method | Youngsuk Kim, Akihito Kawai, Shunsuke Teranishi | 2023-09-12 |
| 11682569 | Workpiece cutting method | Youngsuk Kim | 2023-06-20 |
| 11590629 | Method of processing workpiece and resin sheet unit | Yosuke Murata, Kazuhiro Koike, Youngsuk Kim, Takeshi Sakamoto | 2023-02-28 |