YK

Youngsuk Kim

DI Disco: 7 patents #1 of 139Top 1%
LG: 1 patents #2,112 of 4,679Top 50%
Overall (2023): #11,103 of 537,848Top 3%
8
Patents 2023

Issued Patents 2023

Patent #TitleCo-InventorsDate
11854891 Wafer manufacturing method and laminated device chip manufacturing method Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi 2023-12-26
11764114 Wafer manufacturing method and laminated device chip manufacturing method Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi 2023-09-19
11764115 Wafer manufacturing method and laminated device chip manufacturing method Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi 2023-09-19
11756831 Wafer manufacturing method and laminated device chip manufacturing method Byeongdeck Jang, Akihito Kawai, Shunsuke Teranishi 2023-09-12
11682569 Workpiece cutting method Byeongdeck Jang 2023-06-20
11607771 Wafer processing apparatus 2023-03-21
11590629 Method of processing workpiece and resin sheet unit Yosuke Murata, Kazuhiro Koike, Byeongdeck Jang, Takeshi Sakamoto 2023-02-28
11576314 Plant cultivating apparatus Mina Yang 2023-02-14