Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11700690 | Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design rule | — | 2023-07-11 |
| 11688668 | Component carrier with low shrinkage dielectric material | Seok Kim Tay | 2023-06-27 |
| 11670613 | Arrangement with central carrier and two opposing layer stacks, component carrier and manufacturing method | Nick Xin, Seok Kim Tay | 2023-06-06 |
| 11672079 | Component carrier with improved bending performance | Nick Xin | 2023-06-06 |
| 11617259 | Component carrier with embedded component exposed by blind hole | Seok Kim Tay | 2023-03-28 |
| 11605569 | Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuit | Christian Vockenberger | 2023-03-14 |
| 11589462 | Semi-flexible component carrier with stepped layer structure | Nick Xin, Seok Kim Tay | 2023-02-21 |
| 11546990 | Component carrier with bridge structure in through hole fulfilling minimum distance design rule | — | 2023-01-03 |