Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11672076 | Component carrier with protruding thermally conductive tongue and corresponding method of manufacturing | Naoto Yokoi, Raymond Yi, Sabine Liebfahrt, Ferdinand Lutschounig, Bernhard Reitmaier | 2023-06-06 |
| 11605569 | Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuit | Mikael Tuominen | 2023-03-14 |