Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11778754 | Component carrier with through hole filled with extra plating structure between sidewalls and plated bridge structure | Robin Zhang | 2023-10-03 |
| 11688668 | Component carrier with low shrinkage dielectric material | Mikael Tuominen | 2023-06-27 |
| 11670613 | Arrangement with central carrier and two opposing layer stacks, component carrier and manufacturing method | Mikael Tuominen, Nick Xin | 2023-06-06 |
| 11617259 | Component carrier with embedded component exposed by blind hole | Mikael Tuominen | 2023-03-28 |
| 11589462 | Semi-flexible component carrier with stepped layer structure | Nick Xin, Mikael Tuominen | 2023-02-21 |