Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11646204 | Method for forming a layer provided with silicon | Dieter Pierreux, Bert Jongbloed, Kelly Houben, Werner Knaepen, Wilco Verweij | 2023-05-09 |
| 11610775 | Method and apparatus for filling a gap | Viljami Pore, Werner Knaepen, Bert Jongbloed, Dieter Pierreux, Suvi Haukka +2 more | 2023-03-21 |
| 11594450 | Method for forming a structure with a hole | Dieter Pierreux, Bert Jongbloed | 2023-02-28 |