Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11634830 | Electrochemical depositions of nanotwin copper materials | Jing Xu, Marvin L. Bernt, Eric J. Bergman, Kwan Wook Roh | 2023-04-25 |
| 11578422 | Electroplating system | Paul R. McHugh, Gregory J. Wilson, Kyle M. Hanson, Paul Van Valkenburg, Eric J. Bergman +5 more | 2023-02-14 |