Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11631591 | Methods for depositing dielectric material | Bhargav S. Citla, Jingyi Li, Douglas A. Buchberger, Jr., Zhong Qiang Hua, Srinivas D. Nemani +1 more | 2023-04-18 |
| 11566325 | Silicon carbonitride gapfill with tunable carbon content | Mei-Yee Shek, Bhargav S. Citla, Joshua Rubnitz, Chentsau Chris Ying, Srinivas D. Nemani +1 more | 2023-01-31 |