Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749637 | Hybrid bonding interconnection using laser and thermal compression | Min Ho Kim, Seok Ho Na, Dong Hyeon Park, Choong Hoe Kim, Woo Kyung Ju +1 more | 2023-09-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749637 | Hybrid bonding interconnection using laser and thermal compression | Min Ho Kim, Seok Ho Na, Dong Hyeon Park, Choong Hoe Kim, Woo Kyung Ju +1 more | 2023-09-05 |