Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749637 | Hybrid bonding interconnection using laser and thermal compression | Min Ho Kim, Seok Ho Na, Dong Hyeon Park, Woo Kyung Ju, Yun Seok Song +1 more | 2023-09-05 |
| 11742216 | System and method for laser assisted bonding of an electronic device | Tae Ho Yoon, Yang Gyoo Jung, Min Ho Kim, Youn Seok Song, Dong Soo Ryu | 2023-08-29 |