Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804447 | Semiconductor device having conductive wire with increased attachment angle and method | Jun-Ho Jeon, Kyeong Sool Seong, Jeong Il Kim, Young Kyu Kim, Sung-Ho Jeon +6 more | 2023-10-31 |
| 11749637 | Hybrid bonding interconnection using laser and thermal compression | Min Ho Kim, Dong Hyeon Park, Choong Hoe Kim, Woo Kyung Ju, Yun Seok Song +1 more | 2023-09-05 |