Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515258 | Package substrate and manufacturing method thereof | Xianming Chen, Yejie HONG, Benxia HUANG | 2022-11-29 |
| 11503712 | Passive device packaging structure embedded in glass medium and method for manufacturing the same | Xianming Chen, Yejie HONG, Benxia HUANG | 2022-11-15 |
| 11450619 | Embedded packaging structure having shielding cavity and manufacturing method thereof | Xianming Chen, Min Gu, Lina JIANG, Benxia HUANG, Wenshi Wang | 2022-09-20 |
| 11412449 | Communicating in a wireless network | — | 2022-08-09 |
| 11399440 | Method for manufacturing coreless substrate | Xianming Chen, Jian-Hao Peng, Jida Zhang, Benxia HUANG, Bingsen Xie +1 more | 2022-07-26 |
| 11374720 | Determining a length of a timeout period | — | 2022-06-28 |
| 11371077 | High throughput cell-based screening for aptamers | Xuecui Guo, Alexandria Forbes | 2022-06-28 |
| 11348535 | Display control method, display control module and display device | Chenghao Liao, Chungkee Cheng, Guoqiang Wu | 2022-05-31 |
| 11346662 | Method and device for predicting volume median diameter in overlapped spray area of twin nozzles | Fei Liu, Wenwen Kong, Yufei Liu, Hui Fang, Han Guo +2 more | 2022-05-31 |
| 11342273 | Package structure of integrated passive device and manufacturing method thereof, and substrate | Xianming Chen, Yejie HONG, Benxia HUANG, Bingsen Xie | 2022-05-24 |
| 11297571 | Controlling end nodes of a low-power wide area network | Xiaobo Jiang, Shengli Zhang | 2022-04-05 |
| 11257713 | Interposer board without feature layer structure and method for manufacturing the same | Xianming Chen, Min Gu, Benxia HUANG, Bingsen Xie | 2022-02-22 |