Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515258 | Package substrate and manufacturing method thereof | Xianming Chen, Benxia HUANG, Lei Feng | 2022-11-29 |
| 11503712 | Passive device packaging structure embedded in glass medium and method for manufacturing the same | Xianming Chen, Benxia HUANG, Lei Feng | 2022-11-15 |
| 11342273 | Package structure of integrated passive device and manufacturing method thereof, and substrate | Xianming Chen, Benxia HUANG, Lei Feng, Bingsen Xie | 2022-05-24 |