Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11399440 | Method for manufacturing coreless substrate | Xianming Chen, Jian-Hao Peng, Jida Zhang, Benxia HUANG, Lei Feng +1 more | 2022-07-26 |
| 11342273 | Package structure of integrated passive device and manufacturing method thereof, and substrate | Xianming Chen, Yejie HONG, Benxia HUANG, Lei Feng | 2022-05-24 |
| 11257713 | Interposer board without feature layer structure and method for manufacturing the same | Xianming Chen, Min Gu, Benxia HUANG, Lei Feng | 2022-02-22 |