Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450619 | Embedded packaging structure having shielding cavity and manufacturing method thereof | Xianming Chen, Lei Feng, Lina JIANG, Benxia HUANG, Wenshi Wang | 2022-09-20 |
| 11394084 | Separator and electrochemical device including the same | Kwan Woo Nam | 2022-07-19 |
| 11257713 | Interposer board without feature layer structure and method for manufacturing the same | Xianming Chen, Benxia HUANG, Lei Feng, Bingsen Xie | 2022-02-22 |
| 11245158 | Separator and electrochemical device including the same | Dong-Wook Sung | 2022-02-08 |