Issued Patents 2022
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11445279 | Air-pulse generating device and sound producing method thereof | Wen-Chien Chen, Jye Ren | 2022-09-13 |
| 11438705 | Sound producing device | Martin Lim | 2022-09-06 |
| 11399228 | Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer | Chiung C. Lo, Martin Lim, Wen-Chien Chen, Michael David Housholder, David Hong | 2022-07-26 |
| 11395073 | Sound producing package structure and method for packaging sound producing package structure | Hai-Hung Wen, Chiung C. Lo | 2022-07-19 |
| 11388534 | Electroacoustic convertor, audio device and audio method thereof | — | 2022-07-12 |
| 11387822 | Filter and method with multiplication operation approximation capability | Hsi-Sheng Chen | 2022-07-12 |
| 11336182 | Driving circuit with energy recycle capability | Jing-Meng Liu | 2022-05-17 |
| 11323797 | Acoustic transducer, wearable sound device and manufacturing method of acoustic transducer | Chiung C. Lo, Martin Lim, Wen-Chien Chen, Michael David Housholder, David Hong | 2022-05-03 |
| 11303295 | SDM encoder and related signal processing system | Hsi-Sheng Chen | 2022-04-12 |
| 11304005 | Crossover circuit | Hsi-Sheng Chen, Chiung C. Lo, Wen-Chien Chen, Chun-I Chang, Hao-Hsin Chang +1 more | 2022-04-12 |
| 11290015 | Driving circuit with energy recycle capability | — | 2022-03-29 |
| 11271480 | Driving circuit with energy recycle capability and method thereof | — | 2022-03-08 |
| 11252511 | Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus | Chiung C. Lo, David Hong, Lei Chen, Hai-Hung Wen, JengYaw Jiang +4 more | 2022-02-15 |
| 11251802 | Nonlinear digital-to-analog converter | — | 2022-02-15 |
| 11223891 | System and method thereof | Hsi-Sheng Chen | 2022-01-11 |