Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11252511 | Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus | Chiung C. Lo, David Hong, Jemm Yue Liang, Lei Chen, Hai-Hung Wen +4 more | 2022-02-15 |