Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11395073 | Sound producing package structure and method for packaging sound producing package structure | Chiung C. Lo, Jemm Yue Liang | 2022-07-19 |
| 11252511 | Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus | Chiung C. Lo, David Hong, Jemm Yue Liang, Lei Chen, JengYaw Jiang +4 more | 2022-02-15 |