Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11304005 | Crossover circuit | Jemm Yue Liang, Hsi-Sheng Chen, Chiung C. Lo, Wen-Chien Chen, Hao-Hsin Chang +1 more | 2022-04-12 |
| 11252511 | Package structure and methods of manufacturing sound producing chip, forming package structure and forming sound producing apparatus | Chiung C. Lo, David Hong, Jemm Yue Liang, Lei Chen, Hai-Hung Wen +4 more | 2022-02-15 |