Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401441 | Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications | Laura M. Matz, Chris Keh-Yeuan Li, Ming-Shih Tsai, Pao-Chia Pan, Chad Chang-Tse Hsieh +4 more | 2022-08-02 |
| 11326076 | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives | Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2022-05-10 |
| 11254839 | Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishing | Joseph D. Rose, Hongjun Zhou, Krishna P. Murella, Mark Leonard O'Neill | 2022-02-22 |