Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11401441 | Chemical mechanical planarization (CMP) composition and methods therefore for copper and through silica via (TSV) applications | Xiaobo Shi, Laura M. Matz, Chris Keh-Yeuan Li, Ming-Shih Tsai, Pao-Chia Pan +4 more | 2022-08-02 |
| 11326076 | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives | Xiaobo Shi, Krishna P. Murella, Joseph D. Rose, Hongjun Zhou | 2022-05-10 |
| 11254839 | Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishing | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Krishna P. Murella | 2022-02-22 |