Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11326076 | Shallow trench isolation (STI) chemical mechanical planarization (CMP) polishing with low abrasive concentration and a combination of chemical additives | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2022-05-10 |
| 11254839 | Low oxide trench dishing shallow trench isolation chemical mechanical planarization polishing | Xiaobo Shi, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill | 2022-02-22 |