Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521915 | Front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV) | Chun Lin Tsai, Jiun-Lei Jerry Yu, Po-Chih Chen | 2022-12-06 |
YW
Yun-Hsiang Wang
Overall (2022): #190,374 of 548,613Top 35%
1
Patents 2022