Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532740 | Semiconductor structure, HEMT structure and method of forming the same | Yao-Chung Chang, Jiun-Lei Jerry Yu, Chun Lin Tsai | 2022-12-20 |
| 11521915 | Front-end-of-line (FEOL) through semiconductor-on-substrate via (TSV) | Yun-Hsiang Wang, Chun Lin Tsai, Jiun-Lei Jerry Yu | 2022-12-06 |
| 11222968 | HEMT device structure and manufacturing method thereof | Jiun-Lei Jerry Yu, Yao-Chung Chang, Chun Lin Tsai | 2022-01-11 |