Issued Patents 2022
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527711 | MTJ device performance by controlling device shape | Jesmin Haq, Tom Zhong, Zhongjian Teng, Vinh Lam | 2022-12-13 |
| 11444241 | Self-aligned encapsulation hard mask to separate physically under-etched MTJ cells to reduce conductive R-deposition | Dongna Shen, Vignesh Sundar, Yu-Jen Wang | 2022-09-13 |
| 11430947 | Sub 60nm etchless MRAM devices by ion beam etching fabricated t-shaped bottom electrode | Dongna Shen, Yu-Jen Wang | 2022-08-30 |
| 11375782 | Outdoor umbrella frame having telescopic structure | Tongguo Wang, Jianqiang Xie | 2022-07-05 |
| 11344192 | Lighting device and endoscope having the same | Xiaodong Duan, Xu Wang, Qinghu YOU | 2022-05-31 |
| 11339994 | Control method and control device for variable-frequency and variable-capacity heat pump hot-air drying system | Yujun Wang, Yunyun Wu, Xiaowang Wu, Zhonghai Ji, Ying Wang +1 more | 2022-05-24 |
| 11329218 | Multiply spin-coated ultra-thick hybrid hard mask for sub 60nm MRAM devices | Yu-Jen Wang | 2022-05-10 |
| 11289645 | Method to integrate MRAM devices to the interconnects of 30nm and beyond CMOS technologies | Vignesh Sundar, Dongna Shen, Sahil Patel, Ru-Ying Tong, Yu-Jen Wang | 2022-03-29 |
| 11248824 | Control system and control method for frostless, multivariable coupling, and heat pump-based hot blast stove | Yujun Wang, Xiaojie Ma, Ying Wang, Tianshu Wang | 2022-02-15 |
| 11217746 | Ion beam etching fabricated sub 30nm Vias to reduce conductive material re-deposition for sub 60nm MRAM devices | Dongna Shen, Zhongjian Teng, Jesmin Haq, Yu-Jen Wang | 2022-01-04 |