Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11444241 | Self-aligned encapsulation hard mask to separate physically under-etched MTJ cells to reduce conductive R-deposition | Yi Yang, Vignesh Sundar, Yu-Jen Wang | 2022-09-13 |
| 11430947 | Sub 60nm etchless MRAM devices by ion beam etching fabricated t-shaped bottom electrode | Yi Yang, Yu-Jen Wang | 2022-08-30 |
| 11424405 | Post treatment to reduce shunting devices for physical etching process | Yu-Jen Wang, Vignesh Sundar, Sahil Patel | 2022-08-23 |
| 11411174 | Silicon oxynitride based encapsulation layer for magnetic tunnel junctions | Vignesh Sundar, Yu-Jen Wang, Sahil Patel, Ru-Ying Tong | 2022-08-09 |
| 11316103 | Combined physical and chemical etch to reduce magnetic tunnel junction (MTJ) sidewall damage | Yu-Jen Wang, Ru-Ying Tong, Vignesh Sundar, Sahil Patel | 2022-04-26 |
| 11289645 | Method to integrate MRAM devices to the interconnects of 30nm and beyond CMOS technologies | Yi Yang, Vignesh Sundar, Sahil Patel, Ru-Ying Tong, Yu-Jen Wang | 2022-03-29 |
| 11217746 | Ion beam etching fabricated sub 30nm Vias to reduce conductive material re-deposition for sub 60nm MRAM devices | Yi Yang, Zhongjian Teng, Jesmin Haq, Yu-Jen Wang | 2022-01-04 |